Comparison ledger
Solitec 5110 C Photoresist Spin, TEGAL 211, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 5110 C Photoresist SpinSolitec | 211TEGAL |
|---|---|---|
| OEM | Solitec | TEGAL |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Solitec 5110 C Photoresist Spin | TEGAL 211 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Control Panel has 5 potentiometers for speed setting with individual 0-99.9s timers[1] | — |
| Wafer Handling | Manual with loading paddle to center wafer[1] | — |
| Solvent Dispense | Pressurized tank required[1] | — |
| Substrate Sizes (Max) | 9" Round, 6" square, 9" diagonal rectangular[1] | — |
| Tachometer | Digital readout from optical encoder, 10 rmp resolution[1] | — |
| Acceleration | Variable from 1,000 to 40,000 rpm/sec[1] | — |
| Process Control | Digital timers with manual programming, relay logic[1] | — |
| Time | Variable from 1 to 999 sec in 1 sec increments[1] | — |
| With precise dispense adjustment | 0.5 to 38 mlt 1%, viscosity 4 to 10,000 centistokes[1] | — |
| Refurbished RTP RTA | — | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] |
| KLA-Tencor Spare Parts and Service | — | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] |
| Refurbished Isotropic Plasma Etcher | — | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] |
| Refurbished PECVD, ALD Equipment | — | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] |
| Refurbished Mask Aligner | — | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] |
| Refurbished Bonding | — | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] |
| Refurbished Wafer Prober | — | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] |
| Process Type | — | Plasma Asher/Etcher[3] |
| Wafer Size (max) | — | 3 inch[3] |
| Form Factor | — | Table top[3] |
| Chamber Material | — | Aluminum[2] |
| Chamber Internal Dimensions | — | 6 x 6 x 3.75 inches[2] |
| Timer Range | — | 0-99 minutes[3] |
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