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Comparison ledger

SE 75 DU Horizontal Injectionversus10490

Sumitomo SE 75 DU Horizontal Injection, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMSumitomoWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySumitomo SE 75West Bond 10490
Specifications
Phase3 Phase[1]—
ConfigurationAC200V, 50/60 Hz[1]—
Clamp force75 Ton[2]—
Power inputAC200V, 50/60 Hz[1]—
Power input (alternate)AC220V, 60 Hz[1]—
Inverter current21.7A[3]—
Heater power6.6KW[3]—
Injection unitC110[2]—
Screw diameter25 mm[2]—
Shot size1.7 oz[2]—
Max injection pressure30,780 psi[2]—
Tie bar spacing14.17" x 16.14"[2]—
Mold open stroke (max)11.81"[2]—
Platen daylight (max)27.95"[2]—
Mold mounting height (min)6.30"[2]—
Vintage2006[3]—
Electrical phase3 Phase[3]—
Voltage optionsAC200V, 50/60 Hz; AC220V, 60 Hz[3]—
Manufacturer—West Bond[4]
Model—10490[4]
Description—Convertible bonder, wedge to ball[5]
Tool type—Convertible bonder[6]
Bonding modes—Wedge bonding and ball bonding[6]
Use—Wire bonding[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]plastiwin.complastiwin.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com