Waferpedia

Comparison ledger

150 e MaskversusMA 8 BA 8 Mask

SUSS MicroTec 150 e Mask, SUSS MicroTec MA 8 BA 8 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
MA 8 BA 8 MaskSUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
CategoryLithographyLithography
Wafer size—High precision micrometer for wafer alignment adjustment
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec 150 e MaskSUSS MicroTec MA 8 Mask
Specifications
Configuration—Backside Optical Alignment[1]
Wafer Loading—Manual loading & unloading[1]
Microscope Lenses—2× 5× lenses, 2× 10× lenses[1]
Power—1000 W UV mercury lamp[1]
Wafer size—High precision micrometer for wafer alignment adjustment[1]
Micrometer axes—X / Y / θ (theta)[1]
X / Y minimal travel—10 mm[1]
θ-axis maximum rotation angle—±5°[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing