Comparison ledger
SUSS MicroTec MA / BA Gen4 Pro Series, SUSS MicroTec MA6-BA6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MA / BA Gen4 Pro SeriesSUSS MicroTec | MA6-BA6SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | Gen4 | — |
| Family | SUSS MicroTec MA / BA Gen4 Pro Series | SUSS MicroTec MA6-BA6 |
| Cited variants |
|
|
| Specifications | ||
| Type | Semi-automated system[1] | — |
| Wafer size | up to 150 mm / 200 mm[1] | — |
| Mask alignment | Yes[1] | — |
| Bond alignment | Yes[1] | — |
| Exposure | Yes[1] | — |
| UV bonding | Yes[1] | — |
| Fusion bonding | Yes[1] | — |
| Micro- and nanoimprinting | Yes[1] | — |
| Selective plasma activation | Yes[1] | — |
| System name | — | JBX 6300FS[3] |
| Tool type | — | advanced direct write ebeam lithography system[3] |
| Wafer capacity | — | up to 150mm wafers[3] |
| Feature size capability | — | sub-10 nm features[3] |
| Optical configuration | — | a fifth lens can be used to get a smaller beam spot size[3] |
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