Comparison ledger
SUSS MicroTec SB8E, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SB8ESUSS MicroTec | 10100West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 150mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | Windows NT | — |
| Generation | — | — |
| Family | SUSS MicroTec SB8E | West Bond 10100 |
| Specifications | ||
| Tool type | VAC substrate bonder[1] | — |
| Maximum wafer size | up to 150mm[1] | — |
| Vacuum level | down to 5x10e-5 mbar[1] | — |
| Overpressure | up to 3 bar[1] | — |
| Bonding processes | Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding, Thermal Compression Bonding[1] | — |
| Heating | Double-side heating up to 550 Degrees Celsius[1] | — |
| Power supply | 0 to +/- 2000 VDC with maximum current at 15mA[1] | — |
| Control software platform | Windows NT[1] | — |
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