Comparison ledger
Tegal 6520, Tegal 900, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 6520Tegal | 900Tegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | 2001 | — |
| Production run | 2001– | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2001 Order announcement | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 6520 | Tegal 900 |
| Cited variants | — | |
| Specifications | ||
| Tool type | high-density CCP plasma etch tool[2] | — |
| RF power | dual-frequency RF power application[2] | — |
| Plasma confinement | magnetic plasma confinement[2] | — |
| Wafer size | 100mm – 200mm[2] | 3", 100mm–150mm[1] |
| Process capability | Rinse-Strip-Rinse (RSR)[3] | — |
| Product line | — | 900 Series plasma etch system[5] |
| Substrate handling | — | Handles both round and square substrates[5] |
| Use case | — | Defreckling and backside nitride etching[5] |
| Process type | — | Single wafer plasma RIE[1] |
| Type | — | plasma etch system[5] |
| Applications | — | defreckling and backside nitride etching[5] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →