Waferpedia

Comparison ledger

PMC 1040 Sversus10100

Towa PMC 1040 S, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMTowaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2009 Vintage—
Control system——
Generation——
FamilyTowa PMC 1040 SWest Bond 10100
Specifications
ConfigurationNon-operational[1]—
Workpiece size compatibility100mm x 300mm[2]—
StructureSingle-layer structure, press mechanism with hold frame structure[2]—
TechnologyProprietary compression technologies, modular concept[2]—

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org