Waferpedia

Comparison ledger

0332 F 9453 302 Diffusionversus3TA

Varian 0332 F 9453 302 Diffusion, YES 3TA, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3TAYES
OEMVarianYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—4 in, 5-6 in, 8 in, 12 in
Process node——
Introduced—1980
Production run—1980–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 0332 F 9453 302 DiffusionYES 3TA
Cited variants—
Specifications
Asset Number142841[2]—
Last Confirm DateOctober 14, 2025[3]—
Model—YES-3TA[4]
Category—Vacuum Bake / Vapor Prime Systems[4]
Capacity—8 cassettes of 4-inch wafers, or 1 cassette of 5-8 inch wafers[1]
Cleanliness—less than 10x1 micron particles per 4-inch wafer[1]
Throughput—2 full loads/hr[1]
HMDS usage—<4 ml/200 wafers (120 prime cycles/pint)[1]
Temperature—160°C max[1]
Process type—Vacuum Bake / Vapor Prime[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing
  3. [3]fab-spares.comfab-spares.com
  4. [4]web.archive.orgweb.archive.org