Comparison ledger
West Bond 10490, West Bond wirebond-R1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | wirebond-R1West Bond |
|---|---|---|
| OEM | West Bond | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10490 | West Bond wirebond-R1 |
| Specifications | ||
| Manufacturer | West Bond[1] | — |
| Model | 10490[1] | 7476E[4] |
| Description | Convertible bonder, wedge to ball[2] | — |
| Tool type | Convertible bonder[3] | — |
| Bonding modes | Wedge bonding and ball bonding[3] | 45° wedge and 90° (deep access) wedge configurations[4] |
| Use | Wire bonding[3] | — |
| Vendor | — | West-Bond Inc.[4] |
| Purpose | — | Used for making electrical contacts between semiconductor dies and packages[4] |
| Equipment description | — | Manual wirebonding tool designed to make electrical interconnects between integrated circuit packages and integrated circuit dies[4] |
| Bonding configurations | — | 45° wedge bonding and 90° wedge bonding (deep access)[4] |
| Wire compatibility | — | Optimized for Au or Al wires with a 25 μm (0.001") diameter; compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[4] |
| Ultrasonic transducer | — | 4 W 63 kHz[4] |
| Manual control | — | Available via 8:1 reduction ratio micromanipulator arm[4] |
| Wire types | — | Aluminum and gold wires from 0.7 mil to 2 mil in diameter[4] |
| Optimized wire diameter | — | 25 μm (0.001″)[4] |
| Bonding type | — | Room temperature thermosonic bonding[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →