Waferpedia

Comparison ledger

1000FPversusCV200 RFS

YES 1000FP, YES CV200 RFS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMYESYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size—50mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyYES 1000FPYES CV200 RFS
Specifications
System typePlasma cleaning system[1]—
LineR-Series Plasma Cleaning Systems (Glen Technologies)[1]—
ModelGlen/YES 1000FP[1]—
Designed useDesigned to accept a range of shelf sizes[1]—
Application focusChanging needs of the flat panel industry[1]—
Process—Plasma strip / descum system[2]
Wafer size—50 mm to 200 mm[2]
Power supply—Variable Power Supply from 150 W to 1250 W[2]
Resist removal rate—Up to 7000 angstroms per minute[2]
Temperature measurement—Real-time wafer temperature measurement[2]
Temperature control—Flexible temperature control[2]
Gas inputs—Multiple process gas inputs[2]
Design—Unique downstream protective design[2]
Wafer size range—50 mm to 200 mm[2]
Power supply range—150 W to 1250 W[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]pnf.uchicago.edupnf.uchicago.edu