Comparison ledger
ABM -407B-1-S-CES293 Robot, Nikon S 308 F, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | S 308 FNikon | |
|---|---|---|
| OEM | ABM | Nikon |
| Category | — | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Nikon S 308 F |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Configuration | — | HDD included[2] |
| Light source | — | ArF (193 nm)[3] |
| Numerical aperture | — | 0.92[3] |
| Exposure area | — | 26 x 33 mm[3] |
| Reduction ratio | — | 1:4[3] |
| Resolution | — | <65 nm[3] |
| Throughput (300 mm) | — | >145 wph[3] |
| Throughput (200 mm) | — | >165 wph[3] |
| Wafer size | — | 200/300 mm[3] |
| Overlay accuracy | — | 8 nm[3] |
| Polarization control | — | POLANO[3] |
| Wafer size (alternative) | — | 12 inch[2] |
| Wavelength | — | 193 nm[3] |
| Lens NA | — | 0.92[3] |
| Polarization Control | — | POLANO (optional)[3] |