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Comparison ledger

SS 20 Automatic Dicingversus18 D Surface

Accretech SS 20 Automatic Dicing, Blanchard 18 D Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMAccretechBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech SS 20 Automatic DicingBlanchard 18 D Surface
Cited variants—
Specifications
Max workpiece size (round wafers)250 mm[2]—
Max workpiece size (square wafers)250 mm[2]—
Spindle speed (standard)60,000 rpm[2]—
Spindle speed (optional)80,000 rpm[2]—
Display17-inch touchscreen[2]—
Kerf check functionYes[2]—
Maximum wafer diameter (circular)250 mm[2]—
Maximum square wafer size250 mm x 250 mm[2]—
Maximum sample thickness (tape-mounted)1 mm[3]—
Compatible wafer sizes (reported at one facility)up to 8 inches (200 mm) diameter[3]—
Voltage—416 V[4]
Phase—3 Phase[4]
Cycles—50[4]
Control Voltage—110[4]
Make—Blanchard[4]
Model—18 D[4]
Asset #—153970[4]
Power—416 V, 3 phase[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]accretech.euaccretech.eu
  2. [2]accretech.euaccretech.eu
  3. [3]purdue.atlassian.netpurdue.atlassian.net
  4. [4]inventory listing
  5. [5]Equipment inventory listing