Comparison ledger
Applied Materials 0010-03254 E Chuck, Disco DAG 810 Ring Removal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | DAG 810 Ring RemovalDisco |
|---|---|---|
| OEM | Applied Materials | Disco |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Disco DAG 810 |
| Specifications | ||
| Configuration | — | Convertible to 8"[1] |
| Supported workpiece size | — | Up to Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table)[2] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[2] |
| Grinding wheel diameter | — | Φ200 mm[2] |
| Spindle rated output | — | 4.2 kW[2] |
| Spindle rated torque | — | 5.9 N·m[2] |
| Spindle rotation speed range | — | 1,000 – 7,000 min⁻¹[2] |
| Equipment dimensions (W × D × H) | — | 600 × 1,700 × 1,780 mm[2] |
| Equipment weight | — | Approx. 1,300 kg[2] |
| Wafer size (ring removal variant) | — | 6 inch (convertible to 8 inch)[1] |