Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Canon MPA 600 FA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | MPA 600 FACanon |
|---|---|---|
| OEM | Applied Materials | Canon |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Canon MPA 600 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | Upgraded to 150 mm compatibility[5] |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Type | — | 1X mirror projection auto feeder / mask aligner[6] |
| Auto feeder | — | Single or double, cassette to cassette, backside wafer handling[6] |
| Wafer sizes | — | 4 inch, 5 inch, 6 inch[6] |
| Mask sizes | — | 5 inch, 6 inch, 7 inch[6] |
| Resolution | — | 1.5 um (using positive resist)[6] |
| Illumination | — | 2 kW high pressure mercury lamp[6] |
| Wavelengths used | — | 365 nm (i-line), 405 nm (h-line), 436 nm (g-line)[6] |
| Intensity | — | At 1800 watts power output: 4 inch wafer more than 700 mW, 5 inch wafer more than 650 mW, 6 inch wafer more than 600 mW[6] |
| Intensity / exposure uniformity | — | Within plus/minus 3%[6] |
| Constant temperature control | — | Monitors and controls system temperature within plus/minus 0.3 degrees C[6] |
| Distortion control | — | PDC matic distortion control[6] |
| Automatic alignment | — | HeNe 633 nm laser beam scanning alignment[6] |
| Alignment modes | — | Spot beam / sheet beam[6] |
| Alignment accuracy | — | 3sigma <= 0.54 um[6] |
| Required facilities | — | 200 VAC, 3Phase, 6 kVA, 50/60Hz; Air Supply(CTC): 200 VAC, 3Phase, 8 kVA, 50/60Hz; CDA pressure minimum 6.5 kg/cm2, flow rate 130 lit/min; Vacuum 50 cmHg or more; Exhaust flow for illuminator 6.5 m/sec to 9.5 m/sec[6] |
| Compatibility upgrade | — | Upgraded to 150 mm compatibility[7] |
| Monitor | — | Monitor not included[7] |
| Vintage | — | 1991 vintage[7] |
| Wafer handling | — | Single or double, cassette to cassette, backside wafer handling[7] |
| Tool type | — | 1X mirror projection mask aligner[7] |
| Temperature control | — | Monitors and controls system temperature within plus/minus 0.3 degrees C[7] |
| Power / electrical | — | 200 VAC, 3Phase, 6 kVA, 50/60Hz[7] |
| Air supply (CTC) | — | 200 VAC, 3Phase, 8 kVA, 50/60Hz[7] |
| CDA pressure | — | Minimum 6.5 kg/cm2, flow rate 130 lit/min[7] |
| Vacuum | — | 50 cmHg or more[7] |
| Exhaust flow for illuminator | — | 6.5 m/sec to 9.5 m/sec[7] |