Waferpedia

Comparison ledger

0010-16392 ESC Assemblyversus2300 Versys Kiyo 45

Applied Materials 0010-16392 ESC Assembly, Lam Research 2300 Versys Kiyo 45, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyLam Research 2300 Versys Kiyo 45
Specifications
OEMApplied Materials[1]Lam Research[3]
Model0010-16392[1]2300 Versys Kiyo 45[3]
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Category—Etch[4]
Wafer size—300mm[5]
Tool type—high-density plasma etch system[4]
Application—advanced patterning applications[4]
Processes—conductor and silicon etch processes[4]
Etch characteristics—precise anisotropic etching, excellent critical dimension control, and high aspect ratio capability[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]globaltechsolutions.com.sgglobaltechsolutions.com.sg