Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusTE 8500

Applied Materials 0010-16392 ESC Assembly, Tokyo Electron TE 8500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
TE 8500Tokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyTokyo Electron TE 8500
Cited variants—
  • TE 8500 P Dry[1]
  • TE 8500 PESC Dry[1]
Specifications
OEMApplied Materials[2]—
Model0010-16392[2]—
TypeESC Assembly[2]—
Wafer Size300 mm[3]—
Electrode ConfigurationDual[3]—
Wafer size—6 inch[1]
Process type—Etch (Dry)[5]
Chambers (PESC Dry)—1[1]
Application (PESC Dry)—Oxide etch with endpoint capability[1]
Vintage—1994[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]spwindustrial.comspwindustrial.com
  4. [4]Equipment inventory listing
  5. [5]layla-ec.comlayla-ec.com