Waferpedia

Comparison ledger

0010 47763versusCentura I Phase II Oxide

Applied Materials 0010 47763, Applied Materials Centura I Phase II Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Centura I Phase II OxideApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Applied Materials Centura
Specifications
Configuration2nd Source New[1]Upgradable to 8"[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Need to replace—5-phase motor driver, indexer, turbo pump and controller, e-chuck, MFC's[4]
Wafer size (original)—6 inch[4]
Wafer size (upgrade target)—8 inch (200 mm)[4]
Wafer size (alternate configuration)—200 mm[5]
Model designation alternative—5200 Centura I Phase II[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]fabsurplus.comfabsurplus.com