Comparison ledger
Applied Materials 0010 47763, Applied Materials DPS II CIP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | DPS II CIPApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials DPS |
| Specifications | ||
| Configuration | 2nd Source New[1] | 4x (D4) SILICON DPS II chamber, 12 Gas line (Standard Gas Line)[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | DPS II CIP[4] |
| OEM | Applied Materials[1] | Applied Materials[4] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Applicable | — | 2 Chiller[4] |
| Not applicable | — | Scrubber, Dry Pump[4] |
| Category | — | Etch[5] |
| Tool type | — | Etcher[5] |
| Chamber | — | 4x (D4) SILICON DPS II chamber[4] |
| Gas line | — | 12 Gas line (Standard Gas Line)[4] |
| Chiller | — | 2 Chiller applicable[4] |
| Scrubber | — | Not applicable[4] |
| Dry pump | — | Not applicable[4] |
| Vintage | — | 2005[4] |
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