Comparison ledger
Applied Materials 0010 47763, Lam Research TCP 9600 SE Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | TCP 9600 SE MetalLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research TCP 9600 |
| Specifications | ||
| Configuration | 2nd Source New[1] | SECS Interface[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | TCP 9600 SE[4] |
| OEM | Applied Materials[1] | Lam Research[4] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Install Type | — | Through-the-wall[4] |
| Software Type | — | Lam Envision[4] |
| Software Version | — | E 1.5.2[4] |
| Electrical Requirements | — | 208V/80A[4] |
| PM 1 / Main Chamber | — | Metal Etch[4] |
| Helium Cooling MFC Type | — | UNIT UPC8130[4] |
| Main On-Board AC Distribution Type | — | Fused[4] |
| DSQ Type | — | Hinged[4] |
| Endpoint Type | — | Monochromators[4] |
| Voltage | — | 208 V[5] |
| Wafer Sizes | — | 6 inch, 8 inch[6] |
| SECS Interface | — | Yes[4] |
| Mainframe Type | — | Stand Alone Etcher Mainframe[4] |
| Process Module | — | PM 1 / Main Chamber: Metal Etch[4] |
| Gas Box | — | Orbitally Welded Gas Box[4] |
| Backside Helium Cooling | — | Yes[4] |
| Heated Pumping Manifolds | — | Yes[4] |
| On-Board RF Generators | — | Yes[4] |
| WVDS | — | Yes[4] |
| Indexers | — | Hine 38A Indexers[4] |
| Endpoint Detection System | — | Yes[4] |
| Endpoint Lam PN | — | 830-330546-001[4] |
| Chamber Liner | — | Yes[4] |
| Chamber Anodization Condition | — | Good[4] |
| Electrode Fixed Gap | — | Yes[4] |
| Wafer Clamp Type | — | ESC (Electrostatic Chuck)[4] |
| ESC Type | — | Polyamid[4] |
| Gate Valve Type | — | Pendulum[4] |
| TCP Coil Size | — | 6"[4] |
| Chiller Make/Model | — | Edwards TCU40/80[4] |
| Chiller Electrical Requirements | — | 200/208VAC / 25A[4] |
| Chiller Number of Cooling Channels | — | One[4] |
| Wafer Clamp | — | ESC[4] |
| Gate Valve | — | Pendulum[4] |
| # of Cooling Channels | — | One[4] |
| Gas Panel | — | Standard[4] |
| Chamber Process | — | Metal Etch (PM 1 / Main Chamber)[4] |
| RF Generators | — | On-Board[4] |
| Main AC Distribution Type | — | Fused[4] |
| Electrode Type | — | Fixed Gap[4] |
| Chiller Model | — | Edwards TCU40/80[4] |
| Number of Cooling Channels | — | One[4] |
| Additional Electrical (208 V variant) | — | 208 V[5] |
| Category | — | Etch[4] |
| Main chamber | — | Metal Etch[4] |
| Chiller | — | Edwards TCU40/80[4] |
| Gas panel | — | Standard Gas Panel[4] |
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