Comparison ledger
Applied Materials 0020 17485 Part, Denton Vacuum EE-4, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 17485 PartApplied Materials | EE-4Denton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | 3" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 17485 Part | Denton Vacuum EE-4 |
| Specifications | ||
| Configuration | Strap, RF Out 2 Balanced Coil Match, Hdp[1] | — |
| OEM | — | Denton Vacuum[2] |
| Model | — | EE-4[2] |
| Tool type | — | Electron beam deposition tool[2] |
| Hearth positions | — | 6-position hearth[2] |
| Vacuum environment | — | on the order of e-7 torr[2] |
| Chamber design | — | Dual chamber design[2] |
| Automation | — | Depositions and pump-down/venting sequences are automated using an onboard PLC[2] |
| Substrate handling | — | Rotating substrate holders[2] |
| Available materials | — | Au, Pt, Ag, Ti, Cr, Pd[2] |
| Facility | — | Nanofabrication Facility[2] |
| Location | — | LISE Cleanroom G07[2] |
| Wafer capacity | — | Up to five 3" diameter wafers; or three 4" wafers; or one 6" wafer; or multiple small samples/pieces of wafers[2] |
Plan your fab
Building a Deposition process? Get a complete equipment list.
Open the fab equipment planner →