Comparison ledger
Applied Materials 0020 18455 Part, Applied Materials Centura 5200 HTF RP EPI, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 18455 PartApplied Materials | Centura 5200 HTF RP EPIApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 18455 Part | Applied Materials Centura 5200 |
| Specifications | ||
| Configuration | Shaft,Rf In Local Match, Hdpcvd,Rev3[1] | 3 Chamber[2] |
| Process Type | — | Reduced Pressure Epitaxial Silicon Deposition[2] |
| Number of Chambers | — | 3[2] |
| Condition | — | Refurbished[2] |
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