Comparison ledger
Applied Materials 0020 23839 Part, Temescal 8-pocket, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 23839 PartApplied Materials | 8-pocketTemescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | 4-inch wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 23839 Part | Temescal 8-pocket |
| Specifications | ||
| Configuration | Plate, Sensor Clamp, Hdpcvd Ultima +[1] | — |
| E-beam source | — | Temescal 8-pocket series, 260 e-beam sources[2] |
| Power supply | — | Temescal 10kV power supply[2] |
| Deposition controller | — | Inficon IC/5 programmable crystal thickness monitoring system[2] |
| Base pressure | — | ~ 5e-7 ultimate base pressure[2] |
| Wafer capacity | — | Up to 9 4-inch wafers in lift-off configuration[2] |
| Sample size | — | Pieces or 9x 4-inch wafers for lift-off (normal incidence)[2] |
| Maximum deposition thickness | — | 1.0 microns per run[2] |
| Wafer capacity (lift-off) | — | Up to 9 four-inch wafers[2] |
| Wafer capacity (sidewall coverage) | — | Up to 18 four-inch wafers[2] |
| Sample size (lift-off) | — | Pieces or 9x 4-inch wafers (normal incidence)[2] |
| Sample size (sidewall coverage) | — | 24x 4-inch wafers (planetary)[2] |
| Sample size (6-inch) | — | 4x 6-inch wafers (normal incidence)[2] |
| Available metals | — | Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Cr[2] |
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