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Comparison ledger

0041-26723 Bonded Assemblyversus505

Applied Materials 0041-26723 Bonded Assembly, MRSI 505, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
505MRSI
OEMApplied MaterialsMRSI
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyMRSI 505
Specifications
X-Y Resolution—0.5 micron[1]
Platform Material—Solid Granite Overhead and Base Platform[1]
X-Y Axis Motors—Two Linear Anarad DC Motors with Glass Encoders[1]
Z Axis Motor—One Brushless Ball Screw Drive Motor[1]
Camera System—Three Dual Magnification IR Cameras with Programmable Lighting; Look-up Camera for Flip Chip[1]
Inspection Station—Bottom mounted camera[1]
Controller—Rack Mount Industrial Computer[1]
Vacuum System—Vacuum Surface Pick Up Valves, Meter & Tubing[1]
Work Surface—Large work surface accommodates most input and output options[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]gtsaz.comgtsaz.com