Comparison ledger
Applied Materials 0720 06060 Part, Eagle J750, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | J750Eagle |
|---|---|---|
| OEM | Applied Materials | Eagle |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1998– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Eagle J750 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[2] | — |
| Product family | — | J750[3] |
| Platform context | — | Listed among Teradyne semiconductor test platforms[3] |
| Installed base | — | Over 6,000 test systems[1] |
| Maximum pins | — | 2048 multifunction pins[1] |
| Maximum data rate | — | 400 MHz/800 Mbps[1] |
| Test program development time | — | IG-XL software enables thirty percent faster development of multisite test programs[1] |
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