Comparison ledger
Applied Materials Centura TPCC RTP, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura TPCC RTPApplied Materials | |
|---|---|---|
| OEM | Applied Materials | CEE |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura TPCC RTP | CEE 1000 Hot Plate |
| Specifications | ||
| OEM | Applied Materials[1] | — |
| Model | Centura TPCC[1] | — |
| System type | Rapid Thermal Process (RTP) system[1] | — |
| Wafer size | 8 inch[1] | — |
| Configuration | — | 4"[2] |
| Type | — | Hot Plate[2] |
| Wafer Size | — | 4 inch[2] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →