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Comparison ledger

DPS IIversus200 ACU

Applied Materials DPS II, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DPS IIApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials DPSAxcelis NV GSD 200
Cited variants—
Specifications
ConfigurationLoad port (3)[2]Parts Machine[4]
OEMApplied Materials[2]—
ModelDPS II[2]200 ACU[4]
CategoryEtch[1]—
Wafer size12 inch[2]200mm[6]
Tool classsecond-generation 300mm tool[3]—
Process capabilitysilicon or metal etch[3]—
Scaleabilityscaleable for 200mm wafers[3]—
Onboard subsystemscontroller, endpoint, and gas panel located onboard the tool[3]—
Footprint20 percent smaller than previous 200mm DPS models[3]—
Demonstrated CD uniformityless than 10nm across a 300mm wafer, including the edge die[3]—
Demonstrated metal etch CD uniformityless than five-percent from wafer to wafer and chamber to chamber[3]—
Manufacturer—Axcelis[4]
Tool type—Asher[4]
Serial number—AU6A356AH[6]
Computer system—M 200 PC, M 200[7]
Part number—SC 4572 A[7]
Volts—208[7]
Amps—30[7]
Equipment type—Asher[4]
Wafer configuration—8 inch[5]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]edn.comedn.com
  4. [4]inventory listing
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]wotol.comwotol.com
  7. [7]semistarcorp.comsemistarcorp.com