Waferpedia

Comparison ledger

Mirra 3400 Wversus12 Lapper

Applied Materials Mirra 3400 W, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Mirra 3400 WApplied Materials
12 LapperLapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra 3400 W—
Specifications
Wafer Size8 inch[1]—
Vintage Year1999[1]—
Outside plate diameter—12 inches[2]
Lapping Speed Range—0 to 60 rpm[3]
Wafer Size Compatibility—4 inches or smaller[2]
Input Voltage—110 V[2]
Frequency—60 Hz[2]
Phase—1[2]
Number of Rings—3[2]
Number of Weights—3[2]
Includes Slurry System—Yes[2]
Includes Timer—Yes[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu