Waferpedia

Comparison ledger

Mirra 3400 Wversus15 Lapper

Applied Materials Mirra 3400 W, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Mirra 3400 WApplied Materials
15 LapperLapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra 3400 WLapmaster 15
Specifications
Wafer Size8 inch[1]—
Vintage Year1999[1]—
Number Of Conditioning Rings—Up to 3[2]
Ring ID—Up to 5.5″[2]
Plate Diameter – Outside—15″[2]
Plate Diameter – Inside—3 1/2″[2]
Standard RPM—60[2]
Drive Motor—1/2 HP[2]
Electrics—110V / 1Ph / 60Hz[2]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[2]
Configuration—Equipped with:[2]
Equipped with: 15″ Cast Iron Plate—Included[2]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[2]
Equipped with: (3) Conditioning Rings—Included[2]
Equipped with: (3) Hold Downs—Included[2]
Equipped with: 30 Minute Timer—Included[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing