Comparison ledger
Applied Materials Reflexion, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ReflexionApplied Materials | 12 Benchtop Lapping PolishingLapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Reflexion | Lapmaster 12 Benchtop Lapping Polishing |
| Cited variants | — | |
| Specifications | ||
| Configuration | Dielectric, LK Oxide[2] | Ring lapper[8] |
| Wafer Sizes | 12 inch[2] | — |
| Process Type | Chemical Mechanical Polishing (CMP)[2] | — |
| OEM | Applied Materials[2] | — |
| Model | Reflexion[2] | 12[5] |
| Category | CMP (Chemical Mechanical Polisher)[2] | CMP[6] |
| Wafer Size | 12 inch[2] | — |
| Make | — | Lapmaster[5] |
| Type/Application | — | Single sided[7] |
| Plate diameter | — | 12 in[7] |
| No. of conditioning rings | — | 3[8] |
| Base | — | Rigid, lightweight, cast aluminum base[8] |
| Standard RPM | — | 60 RPM[8] |
| RPM range with variable speed drive | — | 0-60[8] |
| Drive motor - lapper | — | 0.5 HP[8] |
| Drive motor - polisher | — | 0.75 HP[8] |
| Length | — | 25 in[8] |
| Width | — | 18 in[8] |
| Height | — | 24 in[8] |
| Estimated shipping weight | — | 240 lbs[8] |
| Approximate weight | — | 135 lbs / 61 kg[9] |
| Approximate dimensions | — | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[9] |
| Electrical system | — | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[9] |
| Motor | — | 1/3 hp / 0.25 kW motor with gear reducer[9] |
| Abrasive feed system | — | Designed for water or oil based lapping slurries[9] |
| Automatic cycle timer | — | Automatic digital cycle timer[9] |
| Ring configuration | — | Ring lapper[8] |
| Ring ID | — | 4.25 inches[8] |