Comparison ledger
ASM M Feeder II, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | M Feeder IIASM | 10490West Bond |
|---|---|---|
| OEM | ASM | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM M Feeder II | West Bond 10490 |
| Specifications | ||
| Configuration | Configured for Manual Panel Loading[1] | — |
| Bondhead Type | Single bondhead with 4 arms[1] | — |
| System performance - XY placement | ± 0.4 mil (10 um) @ 3g[1] | — |
| System performance - Die rotation | ±1° @ 3g[1] | — |
| System performance - Global array angle | ±0.01o[1] | — |
| System performance - Bonding cycle | 72 ms[1] | — |
| Die size | 90 x 90 - 500 x 500 um[1] | — |
| Die thickness | 3.5 x 3.5-19.7 x 19.7 mil / Min 50 um[1] | — |
| Input material | Standard JEDEC tray[1] | — |
| No. of tray handling | 2[1] | — |
| Carrier size | Max 60 x 60 x 1.5mm (With 50 x 50mm effective bonding area)[1] | — |
| Wafer type | Foton ring[1] | — |
| Wafer ring size (OD) | 7.33"[1] | — |
| Expanded wafer size | 5.9"[1] | — |
| PR system - Image mode | Color[1] | — |
| PR system - Grey level | 256 grey level[1] | — |
| Voltage | 220 Vac, Single Phase[1] | — |
| Optional voltage | 110 Vac[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Compressed air | 6 bar[1] | — |
| Air consumption | 700 LPM @ 6bar[1] | — |
| Vacuum pump | Option[1] | — |
| Full load current | 24A @ 220V[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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