Waferpedia

Comparison ledger

MS 100versus10490

ASM MS 100, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM MS 100West Bond 10490
Cited variants—
Specifications
Operation TypeManual[2]—
Frame MaterialHigh-strength steel[2]—
Vibration DampingRubber vibration damping mounts[2]—
DispenserDie fillet dispenser[2]—
Substrate PlatformSubstrate holder[2]—
DisplayLCD display[2]—
Control InterfaceOperator panel[2]—
Heating SystemTwo-stage[2]—
Safety FeaturesSafety cover, lock, fail-safe switch[2]—
Model VariantMS100Plus[1]—
Model Year (MS100Plus)2014[1]—
Manufacturer—West Bond[3]
Model—10490[3]
Description—Convertible bonder, wedge to ball[4]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]advancedcapitalequipmentsales.comadvancedcapitalequipmentsales.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com