Waferpedia

Comparison ledger

18 D SurfaceversusDS 266

Blanchard 18 D Surface, Meyer Burger DS 266, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
DS 266Meyer Burger
OEMBlanchardMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceMeyer Burger DS 266
Specifications
Voltage416 V[1]400V[3]
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—120A[3]
Frequency—50 Hz[3]
Current—120 A[3]
Vintage—2008[3]
Wafer Size—8 inch[4]
Includes HDD & Software—Yes[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]inventory listing