Comparison ledger
Branson 101-149-053 Gold Booster, SUSS MicroTec FC 150 Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | FC 150 Flip ChipSUSS MicroTec |
|---|---|---|
| OEM | Branson | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | SUSS MicroTec FC 150 Flip Chip |
| Specifications | ||
| Configuration | 1:1.5[1] | 100 kg Bond Pressure[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Voltage | — | 220V, 60Hz[6] |
| Frequency | — | 50 Hz[8] |
| Bond Pressure | — | 50 kg, 100 kg, 200 kg[4] |
| Electrical Requirements | — | 20 Amps, 220V, 60Hz[6] |
| Heating Chuck Size | — | 100 mm[5] |
| Universal Bonding Arm (UBA) | — | 100 mm[5] |
| Automatic Alignment | — | Yes[5] |
| Process Recording | — | Yes[5] |
| Chip and Substrate Cassettes | — | 4 inch[5] |
| Chip Flipper | — | Optional[7] |
| Automatic Alignment (Cognex 8000) | — | Optional[7] |
| Advanced Laser Leveling | — | Optional[7] |
| High Precision SET Reflow Arm (SRA) | — | Optional[7] |
| Force Sensor in Stage | — | Optional[7] |
| Cassette Size | — | 4 inch (100 mm)[5] |
| Heating UBA | — | 100 mm, 200 kg[5] |
| Optional: Chip Flipper | — | Available[7] |
| Optional: Advanced Laser Leveling | — | Available[7] |
| Optional: Universal Bonding Arm (UBA) | — | Available[7] |
| Optional: High Precision SET Reflow Arm (SRA) | — | Available[7] |
| Optional: Force Sensor in Stage | — | Available[7] |
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