Waferpedia

Comparison ledger

11000versus902

Cascade Microtech 11000, Exatron 902, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11000Cascade Microtech
902Exatron
OEMCascade MicrotechExatron
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 11000Exatron 902
Cited variants—
  • Model 902 Random Sort IC Handler[1]
  • Model 902 Burn-in Board Transfer IC Handler[2]
Specifications
ConfigurationWith antivibration table[3]—
Device size range (Random Sort)—0.5mm x 0.5mm – 2.0mm x 2.0mm[1]
X-Y Axis Resolution—0.1mm (0.003")[1]
X-Y Axis Max. Velocity—122cm/s (48"/s)[1]
Z Axis Resolution—±0.1mm (0.003")[1]
Z Axis Repeatability—±0.1mm (0.003")[1]
Placement Force—Up to 10kg (20lbs) force with standard pickup heads[1]
Theta Axis Resolution—0.1°[1]
Theta Axis Repeatability—±0.1mm (0.003")[1]
Power—100-240VAC 50/60Hz @ 240 Watts[1]
Air—5.9 bar (85 PSI) @ 3 CFM clean, dry air[1]
Operational Temp.—13-32°C (55-90°F)[1]
Humidity—35-90% RH non-condensing[1]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]exatron.comexatron.com
  2. [2]exatron.comexatron.com
  3. [3]inventory listing
  4. [4]inventory listing