Waferpedia

Comparison ledger

100versusMicralign

CEE 100, Perkin Elmer Micralign, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
MicralignPerkin Elmer
OEMCEEPerkin Elmer
CategoryLithographyLithography
Wafer size6"2-inch, 2.5-inch, or 3-inch wafers; optionally 4×4-inch, 3.5×3.5-inch, or 3×3-inch masks
Process node——
Introduced—1973
Production run—1971–1990
Lifecycle—Discontinued
Lifecycle milestones—1990 Divestiture
Control system——
Generation——
FamilyCEE 100Perkin Elmer Micralign
Cited variants
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[3]—
Programmable programs10 programs[3]—
Steps per programup to 10 steps[3]—
Programmable step parametersAcceleration, Speed, Time[3]—
Associated documentCEE Model 100CB Spinner.doc[3]—
Wafer sizeUp to 6 inches[3]—
Programs10 programs each with up to 10 steps[3]—
Control parametersAcceleration, Speed, Time[3]—
OEM—Perkin-Elmer[2]
Model family—Micralign[2]
Type—projection aligner[2]
Introduction year—1973[2]
First sold model—Micralign 100[2]
First sold—1973[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]en.wikipedia.orgen.wikipedia.org
  3. [3]nanofab.utah.edunanofab.utah.edu