Comparison ledger
CEE 100 Spin, SUSS MicroTec Delta 12 AQ, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 SpinCEE | Delta 12 AQSUSS MicroTec |
|---|---|---|
| OEM | CEE | SUSS MicroTec |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | Wafer Developing System Configuration |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | SUSS MicroTec Delta |
| Specifications | ||
| Configuration | Volts 115[1] | Software is not included[2] |
| Maximum wafer diameter | — | 200 mm (8 in)[3] |
| Maximum substrate thickness | — | 5 mm[3] |
| Supported wafer diameters | — | 50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)[3] |
| Supported photomask sizes | — | 125 mm x 125 mm, 150 mm x 150 mm[3] |
| Supported developer chemistries | — | AZ400K, AZ300MIF, CD26[3] |
| Process type | — | temperature controlled spray photoresist development, cassette-to-cassette, dry in – dry out[3] |
| Operation control | — | Recipe controlled automated operation with precise temperature control[3] |
| Wafer size | — | Wafer Developing System Configuration |
| Vintage | — | 2009 |
| Coaters & Developers Vintage | — | 2009 |
| Development method | — | temperature controlled spray development[3] |
| Operation mode | — | cassette-to-cassette, recipe controlled[3] |
| Small pieces supported | — | No[3] |
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