Waferpedia

Comparison ledger

1000 Hot PlateversusHotflow 3 20

CEE 1000 Hot Plate, ERSA Hotflow 3 20, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCEEERSA
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateERSA Hotflow 3 20
Cited variants—
  • HOTFLOW 3/20 eHOTFLOW 3[1]
  • HOTFLOW 3/20 siHOTFLOW 3[2]
  • HOTFLOW 3/20 XLHOTFLOW 3[1]
  • HOTFLOW 3/14HOTFLOW 3[1]
  • HOTFLOW 3/26 XLHOTFLOW 3[1]
Specifications
Configuration4"[3]—
TypeHot Plate[3]—
Wafer Size4 inch[3]—
Heating zones (basic)—7 top-side preheating zones, 3 top and bottom-side peak zones[1]
Cooling zones—4-stage version with water recooling (basic: 1 stage)[4]
Conveyor working width—45 – 580 mm[4]
Conveyor speed—20 – 200 cm/min[4]
Process length—5,190 mm[4]
Heated length—3,700 mm[4]
Cooling length—1,490 mm[4]
Dimensions (L x W x H)—6,590 mm x 1,530 mm x 1,450 mm[4]
Weight (incl. options)—approx. 3,200 kg[4]
Nominal rating—65 kW – 104 kW (subject to configuration)[4]
Continuous rating for operation—approx. 12 – 19 kW[4]
Electrical supply—3 x 400 V, N, PE, 50/60 Hz, max fuse 3 x 100 A[4]
Exhaust volume per stack—400 m³/h, 2 stacks[4]
Noise level (permanent)—< 70 dB (A)[4]
Board clearance (standard)—+25/-37 mm[4]
Board clearance (option)—+35/-37 mm[4]
Conveyor height from floor—820 – 980 mm[4]
Working width (conveyor)—45 – 580 mm[4]
Heating length—3,700 mm[4]
Number of preheating zones—7 top-side[1]
Number of peak zones—3 top and bottom-side[1]
Noise level—< 70 dB (A)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]kurtzersa.com.cnkurtzersa.com.cn
  2. [2]fuliu-smt.comfuliu-smt.com
  3. [3]inventory listing
  4. [4]belmet.sibelmet.si