Comparison ledger
CEE 1000 Hot Plate, YES PB8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PB8YES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | Up to 8-inch wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | YES PB8 |
| Cited variants | — | |
| Specifications | ||
| Configuration | 4"[2] | — |
| Type | Hot Plate[2] | — |
| Wafer Size | 4 inch[2] | — |
| Capacity | — | Up to two boats of 8-inch wafers[3] |
| Ramp rate | — | 1-5°C/min[3] |
| Cool-down rate | — | 1-5°C/min[3] |
| Max temperature | — | 450°C[3] |
| Idle temperature | — | 50°C[3] |
| Gas/material compatibility | — | Non-toxic and non-flammable gases/materials only[3] |
| Vacuum level | — | High vacuum; tool overview states 10^-5 Torr[1] |
| Wafer size support | — | Up to 200mm wafers[1] |
| Load type | — | Manual load[1] |
| Process atmosphere | — | Filtered heated nitrogen purging the chamber in a laminar flow[3] |
| Compatibility | — | 4 - Glass and Metal; no low-temperature materials unstable below 500C; no high-vapor-pressure materials; non-toxic and non-flammable gases/materials only[3] |
| Series vacuum level | — | High vacuum (10^-5)[1] |
| Operating temperatures for wafer dehydration | — | 150°C to 450°C[1] |
| Laminar flow pressure range | — | 0.50-500 Torr[1] |
| Evacuation capability | — | Down to 1E-5 Torr using a vacuum turbo pump[1] |
| Cooling package | — | Uses air only, no water[1] |
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