Waferpedia

Comparison ledger

1100 FX Hot Plateversus1088

CEE 1100 FX Hot Plate, Heller 1088, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMCEEHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1100Heller 1088
Specifications
Configuration300 degrees C maximum bake temperature[1]—
Substrate size150 to 300mm[1]—
Voltage240V, 1Ph, 60Hz[1]—
Heating Zones—8 zones (4 top and 4 below) plus 1 cooling zone[2]
Heating Method—Forced convection[2]
Conveyor Width—18 inches (45 cm)[2]
Heated Length—43.5 inches (111 cm)[2]
Overall Length—96 inches (244 cm)[2]
Height—50 inches (127 cm)[2]
Net Weight—900 lbs (409 kg)[2]
Thermal Profiler—Included[2]
Oven Top—Counter balance for easy access to conveyor[2]
Solder Compatibility—Lead-free and leaded soldering[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]smtdevices.comsmtdevices.com