Waferpedia

Comparison ledger

DAG 810 Automaticversus982-10 Dicing

Disco DAG 810 Automatic, Kulicke & Soffa 982-10 Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Dicing & Grinding, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
982-10 DicingKulicke & Soffa
OEMDiscoKulicke & Soffa
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1996 Vintage · 1999 Vintage
Control system——
Generation——
FamilyDisco DAG 810Kulicke & Soffa 982-10 Dicing
Cited variants
  • DAG 810 with Taiko Option[2]
—
Specifications
ConfigurationTaiko Option[2]—
Voltage100 V[2]208V, 3-phase[4]
Phase3 Phase[2]3-phase[4]
Full Load Current10 A[2]—
Largest Load3 A[2]—
Interrupting Capacity14 kA[2]—
Spindle rated power4.2 kW[3]—
Rated torque5.9 N·m[3]—
Speed range1,000 to 7,000 min⁻¹[3]—
Wafer Sizes8 inch[3]—
Vintage2016[3]—
Frequency50/60 Hz[2]—
Wiring3 Wire + Ground[3]—
Control SystemOriginal control system and safety guard, touchscreen interface[3]—
OEMDisco[1]—
ModelDAG 810[1]—
Machine typeAutomatic Grinder[1]—
OptionTaiko Option[2]—
Power supply100 V, 3 phase, 50/60 Hz[2]—
Control systemOriginal control system[3]—
Safety guardOriginal safety guard[3]—
InterfaceTouchscreen interface[3]—
Blade capacity—2”[4]
Vacuum chuck—200mm[4]
Rated current—15A[4]
Rated power—3100VA[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]inventory listing