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Comparison ledger

DFP 8160 Fully Automatedversus15 Lapper

Disco DFP 8160 Fully Automated, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFP 8160 Fully AutomatedLapmaster 15
Specifications
ManufacturerDisco[1]—
ModelDFP 8160[1]—
Tool typeFully automated polisher[1]—
CategoryCMP[2]—
Wafer size8-inch to 12-inch wafers[3]—
Number Of Conditioning Rings—Up to 3[4]
Ring ID—Up to 5.5″[4]
Plate Diameter – Outside—15″[4]
Plate Diameter – Inside—3 1/2″[4]
Standard RPM—60[4]
Drive Motor—1/2 HP[4]
Electrics—110V / 1Ph / 60Hz[4]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[4]
Configuration—Equipped with:[4]
Equipped with: 15″ Cast Iron Plate—Included[4]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[4]
Equipped with: (3) Conditioning Rings—Included[4]
Equipped with: (3) Hold Downs—Included[4]
Equipped with: 30 Minute Timer—Included[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing