Comparison ledger
EV Group 101, EV Group 6200 NT, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | 6200 NTEV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | EV Group 6200 NT |
| Cited variants | — |
|
| Specifications | ||
| OEM | EV Group[2] | — |
| Model | 101[2] | 6200 NT[6] |
| Equipment name | EVG 101 Spray Coater[2] | — |
| NEMO ID | evgspraycoat[2] | — |
| Training required | EVG 101 Training[2] | — |
| Training duration | 1.50 hours[2] | — |
| Processing technique | Resist Spray Coat (manual)[2] | — |
| Cleanliness | "All"[2] | — |
| Location | SNF Paul G Allen L107 Cleanroom[2] | — |
| Wafer diameter (substrate size) | up to 300 mm[3] | — |
| Available modules | Spin coat / OmniSpray® / develop[3] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[3] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[4] | — |
| Cleanliness group (at SNF) | "All"[2] | — |
| Voltage | — | 200V[5] |
| Manufacturer | — | EV Group[6] |
| Tool type | — | Bond Aligner[6] |
| Configuration | — | Semi-automated or automated[1] |
| Wafer/substrate size | — | Up to 200 mm / 8 in[1] |
| Exposure source | — | Mercury light source / UV LED light source[1] |
| Exposure source options | — | Mercury lamp or UV LED lamp source[7] |
| Alignment accuracy | — | Top side alignment: ≤ ±0.5 µm; bottom side alignment: ≤ ±1.0 µm; IR alignment: ≤ ±2.0 µm; bond alignment: ≤ ±2.0 µm; NIL alignment: ≤ ±3.0 µm[1] |
| Throughput | — | Up to 180 WPH in first print mode; up to 140 WPH in automatic alignment mode[1] |
| Exposure modes | — | Vacuum contact / hard contact / soft contact / proximity / curved surface[8] |
| System control | — | Windows-based[8] |
| Multi-language user GUI and support | — | CN, DE, FR, IT, JP, KR[1] |
| Additional capabilities | — | Bond alignment, IR alignment, Nanoimprint lithography (NIL), SmartNIL[1] |
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