Waferpedia

Comparison ledger

101versusNSR S 307 E

EV Group 101, Nikon NSR S 307 E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMEV GroupNikon
CategoryLithographyLithography
Wafer size—Wafer X-Axis is out of order
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101Nikon NSR
Specifications
OEMEV Group[1]—
Model101[1]—
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Wafer—300 mm[4]
Exposure Light Source—ArF excimer laser[4]
Wavelength—193[4]
Resolution—80 nm[5]
Alignment Accuracy—12 nm[4]
Exposure Field—26 x 33 mm[4]
Reduction Ratio—1:4[4]
Wafer size—Wafer X-Axis is out of order[4]
Configuration—Hard Disk, 300mm[6]
Light Source—ArF excimer laser[4]
Lens NA—0.85[5]
Lens Data—Cymer XLA 140[6]
Wafer Size Support—200 mm / 300 mm[5]
Throughput (300 mm)—> 112 WPH[5]
Throughput (200 mm)—> 160 WPH[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org
  6. [6]inventory listing