Waferpedia

Comparison ledger

G 5 62000versus1 WBS 1 Wafer Substrate

F&K Delvotec G 5 62000, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
G 5 62000F&K Delvotec
OEMF&K DelvotecLogitech
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyF&K Delvotec G 5 62000Logitech 1 WBS 1 Wafer Substrate
Specifications
ConfigurationGold Ball[1]—
Phase50/60 Hz, Phase 5, 2.5 A[1]—
PCB70 µm minimum pad size[1]—
Wafer Size—6 inch[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing