Comparison ledger
Hamatech HMR900, Nikon NSR-1505G4, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HMR900Hamatech | NSR-1505G4Nikon |
|---|---|---|
| OEM | Hamatech | Nikon |
| Category | Lithography | Lithography |
| Wafer size | 4" | 4" |
| Process node | — | better than 750 nm resolution; better than 150 nm alignment |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | g-line |
| Family | Hamatech HMR900 | Nikon NSR-1505G4 |
| Specifications | ||
| Tool type | Mask processor[1] | — |
| Primary use | Cr-plate wet processing or cleaning[1] | — |
| Installed media | Developing exposed resist (AZ 351B developer), Cr wet etching (TechniEtch Cr N°1), and resist stripping (AZ 400K non-diluted)[1] | — |
| Substrate size | Square plates up to 7" x 7"[1] | — |
| Supported chuck sizes | 4" x 4", 5" x 5", 6" x 6", and 7" x 7" square plates[1] | — |
| Loading | Manual loading and unloading of substrates[1] | — |
| Rotation | Direct and reverse rotation (CW, CCW)[1] | — |
| Speed accuracy | +/-1 rpm[1] | — |
| Programmable recipes | 20 recipes with 50 steps each[1] | — |
| Substrate fixation | Mechanical side edge substrate fixation; chucks for Cr plates do not use vacuum clamping[1] | — |
| Substrate handling | Manual loading and unloading[1] | — |
| Chuck size | 4" x 4", 5" x 5", 6" x 6", 7" x 7" square plates[1] | — |
| Recipe capacity | 20 recipes, 50 steps each[1] | — |
| Chemical media | AZ 351B developer, TechniEtch Cr N°1, AZ 400K non-diluted, with DI water rinse and drying[1] | — |
| Equipment type | Mask processor[1] | — |
| Process type | Cr-plate wet processing or cleaning[1] | — |
| Chemical treatment 1 | Developing exposed resist with AZ 351B developer[1] | — |
| Chemical treatment 2 | Cr wet etching with TechniEtch Cr N°1[1] | — |
| Chemical treatment 3 | Resist stripping with AZ 400K non-diluted[1] | — |
| Rinse and dry | Intermediate DI water rinse steps and final drying[1] | — |
| Supported mask and reticle types | 4, 5 and 7 inch masks for mask-aligner usage; 6 inch reticules for DUV stepper usage[1] | — |
| Recipe capability | 20 recipes with 50 steps each can be programmed[1] | — |
| Operation | manual loading and unloading of the substrates[1] | — |
| Substrate format | square plates up to 7" x 7"[1] | — |
| Supported plate sizes | 4" x 4", 5" x 5", 6" x 6", 7" x 7"[1] | — |
| Chuck type | multi-size chuck for square plates[1] | — |
| Acceleration / speed accuracy | smooth acceleration and speed accuracy +/-1 rpm[1] | — |
| Process steps | developing exposed resist, Cr wet etching, resist stripping, intermediate DI water rinse steps, and final drying[1] | — |
| Type | — | Wafer stepper[2] |
| Reduction | — | 5x reduction[2] |
| Reticle size | — | 5" reticle[2] |
| Wafer size | — | 4" wafers[2] |
| Exposure source | — | g-line UV[2] |
| Resolution | — | better than 750 nm[2] |
| Alignment | — | better than 150 nm[2] |
| Reduction factor | — | 5x[2] |
| Alignment accuracy | — | better than 150 nm[2] |
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