Comparison ledger
Hesse & Knipps LSB959, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LSB959Hesse & Knipps | 10100West Bond |
|---|---|---|
| OEM | Hesse & Knipps | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps LSB959 | West Bond 10100 |
| Specifications | ||
| Type | Fully automatic heavy wire bonder with thermosonic function[1] | — |
| Machine type | Fully automatic heavy wire bonder with thermosonic function[2] | — |
| Process capability | Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[2] | — |
| Working area | 370 mm x 560 mm x 42 mm[2] | — |
| P-rotation | 440°[2] | — |
| Bondhead frequency | 60 kHz, alternative frequencies on request[2] | — |
| Wire size | Cu: 300 μm – 500 μm, other sizes on request[2] | — |
| Laser | IR fiber laser with power up to 130W[2] | — |
| Temperature output | Programmable temperature output[2] | — |
| Footprint | 805 mm x 1634 mm x 1912 mm[2] | — |
| Weight | Approx. 1300 kg[2] | — |
| Safety classification | Laser class 1[2] | — |
| Monitoring | Continuous real time monitoring of wire deformation, transducer current, frequency, and bond tool temperature within programmable control limits[2] | — |
| Quality control | Process integrated Quality Control (PiQC) is stated as an option[2] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →