Comparison ledger
Koh Young 2014-09-11T12, Yamaha YS 12 F, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2014-09-11T12Koh Young | YS 12 FYamaha |
|---|---|---|
| OEM | Koh Young | Yamaha |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Koh Young 2014-09-11T12 | Yamaha YS 12 F |
| Specifications | ||
| Semiconductor Solutions | Listed as one of the company’s business areas[1] | — |
| Substrate size (min) | — | L50 × W50 mm[2] |
| Substrate size (max) | — | L510 × W460 mm[2] |
| Mounting accuracy | — | ±0.05 mm / CHIP[2] |
| Placement rate | — | 20,000 CPH (company conditions)[2] |
| Component size range | — | 0402 to 45 × 100 mm (including ball electrode components); components up to 15 mm height[2] |
| Component supply method | — | Tape and tray supply[2] |
| Tape component capacity | — | 106 types (8 mm tape conversion)[2] |
| Tray component capacity | — | 15 types (JEDEC tray conversion)[2] |
| Power supply | — | Three-phase AC 200/208/220/240/380/400/416 V ±10%[2] |
| Air supply requirement | — | Above 0.45 MPa, clean and dry[2] |
| Dimensions (with ATS15) | — | L1,254 × W1,755 × H1,475 mm[2] |
| Weight (with ATS15) | — | Approx. 1,370 kg[2] |
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