Waferpedia

Comparison ledger

12 Lapperversus96 Continuous

Lapmaster 12 Lapper, Lapmaster 96 Continuous, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
96 ContinuousLapmaster
OEMLapmasterLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Lapmaster 96 Continuous
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]60 Hz[3]
Phase1[1]3 Phase[3]
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Voltage—460v[3]
Configuration—80 amps[3]
Power supply—3 Phase, 60 Hz, 460 V, 80 amps[6]
Current—80 A[3]
OEM—Lapmaster[3]
Model—96[3]
Equipment type—Continuous Polisher[3]
Electrical—3 Phase, 60 Hz, 460 V, 80 amps[3]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]Equipment inventory listing