Waferpedia

Comparison ledger

15 LapperversusDSS 200 Post

Lapmaster 15 Lapper, Ontrak DSS 200 Post, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMLapmasterOntrak
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Ontrak DSS 200
Cited variants—
  • Ontrak DSS200 Series 1[1]
  • Ontrak DSS200 Series 2[2]
  • DSS-200 Series 1[1]
  • DSS-200 Series 2[2]
  • DSS-200 CE[3]
  • Entrepix Synergy[3]
  • Entrepix Integra[3]
Specifications
Number Of Conditioning RingsUp to 3[4]—
Ring IDUp to 5.5″[4]—
Plate Diameter – Outside15″[4]—
Plate Diameter – Inside3 1/2″[4]—
Standard RPM60[4]—
Drive Motor1/2 HP[4]—
Electrics110V / 1Ph / 60Hz[4]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[4]—
ConfigurationEquipped with:[4]With Hepa Mini-Environment[5]
Equipped with: 15″ Cast Iron PlateIncluded[4]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[4]—
Equipped with: (3) Conditioning RingsIncluded[4]—
Equipped with: (3) Hold DownsIncluded[4]—
Equipped with: 30 Minute TimerIncluded[4]—
Tool type—double-sided PVA scrubber[2]
Wafer size range—100mm to 200mm[1]
Throughput—45-65 wafers per hour[2]
Post-CMP cleaning applications—oxide, polysilicon, nitride, tungsten, aluminum and copper[2]
Type—Double-sided PVA scrubber / post-CMP cleaner[2]
Wafer sizes (listing)—8 inch[5]
Cleanroom environment (listing)—With HEPA mini-environment[5]
Brush type—Roller PVA[3]
Downforce control—Yes[3]
Drying method—Spin + heat lamp[3]
NH4OH dispense—Yes[3]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]axustech.comaxustech.com
  2. [2]axustech.comaxustech.com
  3. [3]entrepix.comentrepix.com
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing