Waferpedia

Comparison ledger

15 Lapperversus6 DS SP Planarizer

Lapmaster 15 Lapper, Strasbaugh 6 DS SP Planarizer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Strasbaugh 6 DS SP Planarizer
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]4 cassettes inside the tool (2 sender, 2 receiver)[3]
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
Wafer compatibility—4", 6", 8"[2]
Throughput—7 wafer/hour for 800sec of polishing / wafer[2]
Loader unit type—Carrier Entegris PA 194-60MB-61C02[2]
Number of cassettes—2 lots at the same time / 4 cassettes inside the tool (2 sender, 2 receiver)[2]
Nominal wafer size—6 inch[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing